Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12258472 | Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device | Tatsuki SATO, Masaki Minami | 2025-03-25 |
| 11897998 | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device | Masaki Minami, Tatsuki SATO | 2024-02-13 |
| 11584824 | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device | Masaki Minami, Tatsuki SATO | 2023-02-21 |
| 11578166 | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device | Masaki Minami, Tatsuki SATO | 2023-02-14 |
| 11560465 | Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device | Masaki Minami | 2023-01-24 |
| 11555092 | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device | Tatsuki SATO, Masaki Minami | 2023-01-17 |
| 8921461 | Epoxy resin composition and semiconductor device | Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno | 2014-12-30 |
| 8697803 | Epoxy resin composition and semiconductor device | Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno | 2014-04-15 |
| 8324326 | Epoxy resin composition and semiconductor device | Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno | 2012-12-04 |
| 8008410 | Epoxy resin composition for encapsulating semiconductor and semiconductor device | Takahiro Kotani, Daisuke Oka | 2011-08-30 |
| 7354978 | Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound | — | 2008-04-08 |