Issued Patents All Time
Showing 76–100 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8283566 | Printed circuit boards by massive parallel assembly | JengPing Lu | 2012-10-09 |
| 8272392 | Electrostatically addressable microvalves | Ashish Pattekar, Eric Peeters | 2012-09-25 |
| 8241509 | Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal | Thomas Hantschel, David K. Fork, Dirk De Bruyker, Michel A. Rosa | 2012-08-14 |
| 8218334 | Multi-chip module with multi-level interposer | John E. Cunningham, James G. Mitchell, Ivan Shubin | 2012-07-10 |
| 8181336 | Micro-assembler | Jeng Ping Lu, Meng H. Lean, David K. Biegelsen | 2012-05-22 |
| 8119315 | Imaging members for ink-based digital printing comprising structured organic films | Matthew A. Heuft, Adrien P. Cote, Nan-Xing Hu | 2012-02-21 |
| 8082660 | Xerographic micro-assembler | Jeng Ping Lu | 2011-12-27 |
| 8080221 | Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal | Thomas Hantschel, David K. Fork, Dirk De Bruyker, Michel A. Rosa | 2011-12-20 |
| 8080293 | Micro-machined structure production using encapsulation | Thomas Hantschel, Sven Kosgalwies, Gordon Todd Jagerson, Jr. | 2011-12-20 |
| 8053168 | Printing plate and system using heat-decomposable polymers | Jurgen H. Daniel, Dirk De Bruyker | 2011-11-08 |
| 8040364 | Latent resistive image layer for high speed thermal printing applications | Timothy Stowe, Ashish Pattekar, Eric Peeters | 2011-10-18 |
| 8039938 | Airgap micro-spring interconnect with bonded underfill seal | Christopher L. Chua, Bowen Cheng, Dirk De Bruyker | 2011-10-18 |
| 7995081 | Anisotropically conductive backside addressable imaging belt for use with contact electrography | Timothy Stowe, Chu-heng Liu, Jeng Ping Lu, Gregory B. Anderson, Armin R. Volkel +1 more | 2011-08-09 |
| 7982290 | Contact spring application to semiconductor devices | Christopher L. Chua, Eric Peeters | 2011-07-19 |
| 7943504 | Self-releasing spring structures and methods | Thomas Hantschel, Sven Kosgalwies, David K. Fork | 2011-05-17 |
| 7927905 | Method of producing microsprings having nanowire tip structures | Pengfei Qi | 2011-04-19 |
| 7886662 | Digital printing plate and system with electrostatically latched deformable membranes | Dirk De Bruyker, JengPing Lu, Jurgen H. Daniel, Armin R. Volkel | 2011-02-15 |
| 7884361 | Pattern-print thin-film transistors with top gate geometry | William S. Wong, Rene A. Lujan | 2011-02-08 |
| 7861405 | System for forming a micro-assembler | Jeng Ping Lu, Meng H. Lean, David K. Biegelsen | 2011-01-04 |
| 7804090 | Patterned-print thin-film transistors with top gate geometry | William S. Wong, Rene A. Lujan | 2010-09-28 |
| 7800388 | Curved spring structure with elongated section located under cantilevered section | Thomas Hantschel | 2010-09-21 |
| 7749396 | Method of manufacturing fine features for thin film transistors | William S. Wong, Michael L. Chabinyc, Ana Claudia Arias | 2010-07-06 |
| 7749448 | Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal | Thomas Hantschel, David K. Fork, Dirk De Bruyker, Michel A. Rosa | 2010-07-06 |
| 7730615 | Micro-machined structure production using encapsulation | Thomas Hantschel, Sven Kosgalwies, Gordon Todd Jagerson, Jr. | 2010-06-08 |
| 7687108 | Methods for manufacturing stressed material and shape memory material MEMS devices | Baomin Xu, David K. Fork, Michael Y. Young | 2010-03-30 |