Issued Patents All Time
Showing 51–75 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8869695 | Anilox metering system for electrographic printing | Jing Zhou, Gerald A. Domoto, Grace T. Brewington | 2014-10-28 |
| 8850694 | Systems and methods for forming micro-object assemblies | Jeng Ping Lu, Meng H. Lean, David K. Biegelsen | 2014-10-07 |
| 8820233 | Anilox metering system for electrographic printing | Jing Zhou, Gerald A. Domoto, Grace T. Brewington | 2014-09-02 |
| 8736049 | Micro-plasma generation using micro-springs | Bowen Cheng, Dirk DeBruyker | 2014-05-27 |
| 8686552 | Multilevel IC package using interconnect springs | Dirk DeBruyker | 2014-04-01 |
| 8685769 | Microchip charge patterning | JengPing Lu, Armin R. Volkel, Bing R. Hsieh, Gregory Whiting | 2014-04-01 |
| 8652878 | Stress-engineered interconnect packages with activator-assisted molds | Christopher L. Chua, Bowen Cheng, Dirk De Bruyker | 2014-02-18 |
| 8646471 | Electrostatically addressable microvalves | Ashish Pattekar, Eric Peeters | 2014-02-11 |
| 8614514 | Micro-spring chip attachment using ribbon bonds | Vernon B. Powers | 2013-12-24 |
| 8561963 | Electrostatically addressable microvalves | Ashish Pattekar, Eric Peeters | 2013-10-22 |
| 8541741 | Photonic measurement instrument using fiber optics | Juan C. Ivaldi, Paul L. St. Cyr, Mark C. Werner | 2013-09-24 |
| 8525353 | Microspring structures adapted for target device cooling | Eric J. Shrader, John S. Paschkewitz | 2013-09-03 |
| 8519534 | Microsprings partially embedded in a laminate structure and methods for producing same | Eric Peeters | 2013-08-27 |
| 8487970 | Digital imaging of marking materials by thermally induced pattern-wise transfer | Timothy Stowe, Ashish Pattekar, Eric Peeters | 2013-07-16 |
| 8441808 | Interposer with microspring contacts | — | 2013-05-14 |
| 8435612 | Micro-machined structure production using encapsulation | Thomas Hantschel, Sven Kosgalwies, Gordon Todd Jagerson, Jr. | 2013-05-07 |
| 8405198 | Stress-engineered interconnect packages with activator-assisted molds | Christopher L. Chua, Bowen Cheng, Dirk De Bruyker | 2013-03-26 |
| 8399296 | Airgap micro-spring interconnect with bonded underfill seal | Christopher L. Chua, Bowen Cheng, Dirk De Bruyker | 2013-03-19 |
| 8393785 | Nanocalorimeter based on thermal probes | Dirk De Bruyker, Francisco E. Torres, Michal V. Wolkin, Gregory B. Anderson | 2013-03-12 |
| 8355035 | Digital gravure printing with a pixilated photoconductor | JenPing Lu | 2013-01-15 |
| 8330485 | Curved spring structure with downturned tip | Dirk DeBruyker | 2012-12-11 |
| 8318542 | Contact spring application to semiconductor devices | Christopher L. Chua, Eric Peeters | 2012-11-27 |
| 8312619 | Micro-assembler | Jeng Ping Lu, Meng H. Lean, David K. Biegelsen | 2012-11-20 |
| 8291823 | Digital printing plate and system with electrostatically latched deformable membranes | Dirk De Bruyker, JengPing Lu, Jurgen H. Daniel, Armin R. Volkel | 2012-10-23 |
| 8287744 | Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal | Thomas Hantschel, David K. Fork, Dirk De Bruyker, Michel A. Rosa | 2012-10-16 |