Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6567270 | Semiconductor chip package with cooling arrangement | Wen-Lo Shieh, Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang +4 more | 2003-05-20 |
| 6499648 | Method and device for making a metal bump with an increased height | Wen-Lo Shieh, Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang +4 more | 2002-12-31 |