Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343499 | Integrated circuit stack with strengthened wafer bonding | Hsin-Neng Tai, Hung-Ming Weng, Michael Chen | 2016-05-17 |
| 8000520 | Apparatus and method for testing image sensor wafers to identify pixel defects | Chia-Lun Chang, John T. Yue | 2011-08-16 |
| 7368772 | Active pixel having reduced dark current in a CMOS image sensor | Xinping He, Tiemin Zhao | 2008-05-06 |
| 7105878 | Active pixel having reduced dark current in a CMOS image sensor | Xinping He, Hongli Yang | 2006-09-12 |
| 7091058 | Sacrificial protective layer for image sensors and method of using | Xinping He | 2006-08-15 |
| 6909162 | Surface passivation to reduce dark current in a CMOS image sensor | Tiemin Zhao, Xinping He | 2005-06-21 |
| 6649950 | Active pixel having reduced dark current in a CMOS image sensor | Xinping He, Tiemin Zhao | 2003-11-18 |
| 6462365 | Active pixel having reduced dark current in a CMOS image sensor | Xinping He, Tiemin Zhao | 2002-10-08 |