Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607861 | Die separation using adhesive-layer laser scribing | Siriluck Wongratanaporngoorn, Yao Jung Chang, Ekapong Tangpattanasaeree, Paradee Jitrungruang | 2020-03-31 |
| 10297500 | Semiconductor wafer dicing method | Crispulo Estira Lictao, JR., Siriluck Wongratanaporngoorn, Matthew Fernandez, Amileth Dejan Cabrera | 2019-05-21 |
| 9812339 | Method of assembling semiconductor devices of varying thicknesses | Pimpa Boonyatee, Paradee Jitrungruang | 2017-11-07 |