Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607861 | Die separation using adhesive-layer laser scribing | Yao Jung Chang, Ekapong Tangpattanasaeree, Paradee Jitrungruang, Pitak Seantumpol | 2020-03-31 |
| 10297500 | Semiconductor wafer dicing method | Crispulo Estira Lictao, JR., Pitak Seantumpol, Matthew Fernandez, Amileth Dejan Cabrera | 2019-05-21 |