Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607861 | Die separation using adhesive-layer laser scribing | Siriluck Wongratanaporngoorn, Yao Jung Chang, Ekapong Tangpattanasaeree, Pitak Seantumpol | 2020-03-31 |
| 9812339 | Method of assembling semiconductor devices of varying thicknesses | Pimpa Boonyatee, Pitak Seantumpol | 2017-11-07 |