Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9760132 | Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad | Leilei Zhang, Abraham Yee, Zuhair Bokharey | 2017-09-12 | $201,570,000 |
| 9716051 | Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity | Leilei Zhang, Abraham Yee, Zuhair Bokharey | 2017-07-25 | $565,998,000 |
| 9368422 | Absorbing excess under-fill flow with a solder trench | Leilei Zhang, Abraham Yee, Zuhair Bokharey | 2016-06-14 | $17,088,000 |