Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7790510 | Metal lid with improved adhesion to package substrate | — | 2010-09-07 |
| 7652369 | Integrated circuit package and apparatus and method of producing an integrated circuit package | — | 2010-01-26 |
| 7545028 | Solder ball assembly for a semiconductor device and method of fabricating same | — | 2009-06-09 |
| 7388284 | Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit | — | 2008-06-17 |
| 7342298 | Metal lid with improved adhesion to package substrate | — | 2008-03-11 |
| 7241640 | Solder ball assembly for a semiconductor device and method of fabricating same | — | 2007-07-10 |
| 6744131 | Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidity | Lan H. Hoang, Hoa Do | 2004-06-01 |