HF

Hirofumi Fujii

ND Nitto Denko: 23 patents #97 of 2,479Top 4%
KS Kobe Steel: 15 patents #55 of 1,773Top 4%
PA Panasonic: 13 patents #1,866 of 21,108Top 9%
SC Shinko Electric Industries Co.: 5 patents #155 of 723Top 25%
IN Intel: 5 patents #7,174 of 30,777Top 25%
Canon: 4 patents #10,118 of 19,416Top 55%
KS Kobe Steel: 3 patents #504 of 2,031Top 25%
NS Nitto Shinko: 3 patents #4 of 39Top 15%
NI Nitta: 2 patents #54 of 237Top 25%
Mitsubishi Electric: 2 patents #11,187 of 25,717Top 45%
TS Toshiba Energy Systems & Solutions: 2 patents #150 of 569Top 30%
TI Tokyo Electric Power Company Holdings, Incorporated: 2 patents #90 of 711Top 15%
Ricoh Company: 1 patents #6,936 of 9,818Top 75%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
Sumitomo Electric Industries: 1 patents #13,249 of 21,551Top 65%
TS Toshiba Medical Systems: 1 patents #656 of 1,088Top 65%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
Overall (All Time): #25,629 of 4,157,543Top 1%
75
Patents All Time

Issued Patents All Time

Showing 51–75 of 75 patents

Patent #TitleCo-InventorsDate
6956603 Moving object detecting method, apparatus and computer program product 2005-10-18
6904674 Process for manufacturing a printed wiring board Kazunori Mune, Satoshi Tanigawa 2005-06-14
6889426 Method for manufacturing wired circuit board Shunichi Hayashi 2005-05-10
6858473 Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device Kazuhito Hosokawa, Takuji Okeyui, Yasuhik Yamamoto 2005-02-22
6772515 Method of producing multilayer printed wiring board Tokihito Suwa, Atsushi Tanaka, Satoshi Tanigawa, Kazunori Mune 2004-08-10
6767627 Hard film, wear-resistant object and method of manufacturing wear-resistant object Yasuomi Morikawa, Toshiki Sato 2004-07-27
6746816 Photosensitive resin composition and circuit board Shunichi Hayashi 2004-06-08
6662442 Process for manufacturing printed wiring board using metal plating techniques Kouji Matsui, Kazunori Mune, Satoshi Tanigawa 2003-12-16
6623843 Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board Shunichi Hayashi 2003-09-23
6591491 Method for producing multilayer circuit board Satoshi Tanigawa 2003-07-15
6379159 Interposer for chip size package and method for manufacturing the same Kazunori Mune, Kazuo Ouchi, Satoshi Tanigawa 2002-04-30
6334405 Vacuum arc evaporation source and vacuum arc vapor deposition apparatus Kazuki Takahara 2002-01-01
6300037 Photosensitive resin composition and adhesive Satoshi Tanigawa 2001-10-09
6048663 Negative-working photoresist compositions and and use thereof Shunichi Hayashi 2000-04-11
5854094 Process for manufacturing metal plane support for multi-layer lead frames Yoshiki Takeda, Mitsuharu Shimizu 1998-12-29
5851736 Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern Toshihiko Omote, Shun Hayashi 1998-12-22
5744017 Vacuum arc deposition apparatus Hiroshi Tamagaki, Hiroshi Kawaguchi, Katsuhiko Shimojima, Takeshi Suzuki, Koji Hanaguri 1998-04-28
5730847 Arc ion plating device and arc ion plating system Koji Hanaguri, Kunihiko Tsuji, Homare Nomura, Hiroshi Tamagaki, Hiroshi Kawaguchi +4 more 1998-03-24
5665523 Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern Toshihiko Omote 1997-09-09
5410180 Metal plane support for multi-layer lead frames and a process for manufacturing such frames Yoshiki Takeda, Mitsuharu Shimizu 1995-04-25
5291060 Lead frame and semiconductor device using same Mitsuharu Shimizu, Yoshiki Takeda 1994-03-01
5237202 Lead frame and semiconductor device using same Mitsuharu Shimizu, Yoshiki Takeda 1993-08-17
5235209 Multi-layer lead frame for a semiconductor device with contact geometry Mitsuharu Shimizu, Yoshiki Takeda 1993-08-10
4725819 Fire detection system Koju Sasaki, Seiichi Tanaka, Tetsuo Kimura 1988-02-16
4524351 Smoke detector Tetsuo Kimura, Hayami Yuasa, Tatuo Yonezawa 1985-06-18