Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5569545 | Copper clad laminate, multilayer printed circuit board and their processing method | Hitoshi Yokono, Haruki Yokono, Masahiro Mikamo, Takuya Iida, Yasuhiro Endo | 1996-10-29 |