Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5569545 | Copper clad laminate, multilayer printed circuit board and their processing method | Hitoshi Yokono, Haruki Yokono, Ryouichi Narushima, Takuya Iida, Yasuhiro Endo | 1996-10-29 |
| 5061550 | Multilayer material having a resistance layer formed on an electrically conductive layer and a multilayer board for a printed circuit board which has a resistance layer | Kazunao Shimizu, Takeshi Yamagishi | 1991-10-29 |