Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5569545 | Copper clad laminate, multilayer printed circuit board and their processing method | Hitoshi Yokono, Masahiro Mikamo, Ryouichi Narushima, Takuya Iida, Yasuhiro Endo | 1996-10-29 |
| 4824509 | Method for pressure lamination utilizing fluid medium with partial solidification thereof for sealing pressure chamber | Kenji Tonoki, Kazuyoshi Tsunoda, Hisao Kono, Ryoji Yokoyama, Fumiaki Nakamura | 1989-04-25 |
| 4734155 | Method and device for manufacturing a laminated material | Kazuyoshi Tsunoda, Kenji Tonoki, Hisao Kono, Ryoji Yokoyama, Kazuo Kobayashi | 1988-03-29 |
| 4734299 | Sensitizing agent for electroless plating and method for sensitizing substrate with the agent | Isao Matuzaki, Kenzi Tonoki, Takehiko Ishibashi | 1988-03-29 |
| 4428995 | Glass cloth and prepreg containing same | Tsugihiko Hiratsuka | 1984-01-31 |