Issued Patents All Time
Showing 26–50 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11378722 | Optical lens head, camera module and assembling method therefor | Mingzhu Wang, Nan Guo, Chunmei Liu | 2022-07-05 |
| D953599 | Lamp | — | 2022-05-31 |
| 11303789 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei +1 more | 2022-04-12 |
| 11289521 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device | Mingzhu Wang, Zhenyu Chen, Nan Guo, Bojie Zhao, Takehiko Tanaka +2 more | 2022-03-29 |
| D945047 | Lamp | — | 2022-03-01 |
| 11223751 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao +4 more | 2022-01-11 |
| 11163216 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Nan Guo +4 more | 2021-11-02 |
| 11099353 | Adjustable optical lens and camera module, manufacturing method and applications thereof | Mingzhu Wang, Bojie Zhao, Liang Ding, Feifan Chen, Chunmei Liu +2 more | 2021-08-24 |
| 11081518 | Semiconductor packaging method and semiconductor device based on molding process | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Nan Guo | 2021-08-03 |
| 11060938 | Dual-purpose calibration system for optical pressure sensitive paint considering static and sinusoidal pressure changes, and calibration method | Limin Gao, Ning Ge, Tianyu Gao, Guanhua YANG | 2021-07-13 |
| 11025805 | System-level camera module with electrical support and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Feifan Chen, Liang Ding, Nan Guo +1 more | 2021-06-01 |
| 10976514 | Adjustable optical lens and camera module and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Liang Ding, Chunmei Liu, Feifan Chen +1 more | 2021-04-13 |
| 10928605 | Adjustable optical lens and camera module and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Liang Ding, Chunmei Liu, Feifan Chen +1 more | 2021-02-23 |
| 10908324 | Molded photosensitive assembly of array imaging module | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen +4 more | 2021-02-02 |
| 10782593 | Lens module and capturing module intergrating focusing mechanism and assembly method therefor | Mingzhu Wang, Feifan Chen, Chunmei Liu, Nan Guo, Hong-Jiang Li +2 more | 2020-09-22 |
| 10750071 | Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei +1 more | 2020-08-18 |
| 10732376 | Camera lens module and manufacturing method thereof | Mingzhu Wang, Chunmei Liu, Hailong Liao, Yiqi Wang, Liang Ding +3 more | 2020-08-04 |
| 10735637 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei +1 more | 2020-08-04 |
| 10701255 | Photographing module and electric bracket thereof | Mingzhu Wang, Baozhong ZHANG, Zhenyu Chen, Zhen Huang | 2020-06-30 |
| 10678016 | Camera lens module with one or more optical lens modules and manufacturing method thereof | Mingzhu Wang, Feifan Chen, Chunmei Liu, Bojie Zhao, Nan Guo +1 more | 2020-06-09 |
| 10670946 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2020-06-02 |
| 10630876 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Takehiko Tanaka, Nan Guo +4 more | 2020-04-21 |
| 10578837 | Molded photosensitive assembly for array imaging module for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen +4 more | 2020-03-03 |
| 10582097 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao +4 more | 2020-03-03 |
| 10461116 | Semiconductor packaging method and semiconductor device based on molding process | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Nan Guo | 2019-10-29 |