Issued Patents All Time
Showing 76–100 of 145 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10958816 | Camera module and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Zhen Huang, Nan Guo | 2021-03-23 |
| 10928605 | Adjustable optical lens and camera module and manufacturing method thereof | Mingzhu Wang, Liang Ding, Chunmei Liu, Feifan Chen, Nan Guo +1 more | 2021-02-23 |
| 10908324 | Molded photosensitive assembly of array imaging module | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2021-02-02 |
| 10897611 | Fixed-focus photographing module and focusing device and method thereof | Zhenyu Chen, Mingzhu Wang, Xiaojuan Su | 2021-01-19 |
| 10827103 | Fixed-focus camera module and manufacturing method therefor | Zhenyu Chen, Mingzhu Wang, Xiaojuan Su | 2020-11-03 |
| 10804305 | Manufacture of semiconductor module with dual molding | Mingzhu Wang, Nan Guo, Zhenyu Chen, Takehiko Tanaka, Feifan Chen +1 more | 2020-10-13 |
| 10782593 | Lens module and capturing module intergrating focusing mechanism and assembly method therefor | Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Nan Guo +2 more | 2020-09-22 |
| 10768391 | Adjustable optical lens and camera module and aligning method thereof | Mingzhu Wang, Liang Ding, Chunmei Liu, Feifan Chen, Nan Guo | 2020-09-08 |
| 10770494 | Imaging assembly, method and molding mold for fabricating same, camera module, and smart terminal | Takehiko Tanaka, Lifeng YAO, Zhewen Mei | 2020-09-08 |
| 10750071 | Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding +1 more | 2020-08-18 |
| 10750074 | Camera module and electrical holder and assembling method thereof | Mingzhu Wang, Nan Guo, Feifan Chen, Bo Peng, Zhen Huang | 2020-08-18 |
| 10741594 | Imaging assembly, method and molding mold for fabricating same, camera module, and smart terminal | Takehiko Tanaka, Lifeng YAO, Zhewen Mei | 2020-08-11 |
| 10742859 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, ZHONG-DAN DENG | 2020-08-11 |
| 10732376 | Camera lens module and manufacturing method thereof | Mingzhu Wang, Chunmei Liu, Hailong Liao, Yiqi Wang, Liang Ding +3 more | 2020-08-04 |
| 10735637 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding +1 more | 2020-08-04 |
| 10708480 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Zilong Deng | 2020-07-07 |
| 10678016 | Camera lens module with one or more optical lens modules and manufacturing method thereof | Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Nan Guo +1 more | 2020-06-09 |
| 10670946 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Zhen Huang, Duanliang Cheng +4 more | 2020-06-02 |
| 10666847 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Zilong Deng | 2020-05-26 |
| 10659664 | Camera module and molded circuit board assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Zilong Deng | 2020-05-19 |
| 10630876 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2020-04-21 |
| 10582097 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Zhen Huang +4 more | 2020-03-03 |
| 10578837 | Molded photosensitive assembly for array imaging module for electronic device | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2020-03-03 |
| 10498942 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Zilong Deng | 2019-12-03 |
| 10477088 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka | 2019-11-12 |