HM

Hajime MITSUISHI

NI Nikon: 13 patents #314 of 2,493Top 15%
Overall (All Time): #370,063 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
12165902 Substrate bonding apparatus and substrate bonding method Isao Sugaya, Atsushi Kamashita, Masashi Okada, Minoru Fukuda, Hidehiro Maeda 2024-12-10
12107068 Method and device for manufacturing stacked substrate Isao Sugaya 2024-10-01
12100667 Apparatus for stacking substrates and method for the same Isao Sugaya, Kazuya Okamoto, Minoru Fukuda 2024-09-24
12080554 Bonding method, bonding device, and holding member Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda, Ikuhiro Kuwano 2024-09-03
11842905 Stacked substrate manufacturing method, stacked substrate manufacturing apparatus, stacked substrate manufacturing system, and substrate processing apparatus Isao Sugaya 2023-12-12
11823935 Stacking apparatus and stacking method Isao Sugaya, Minoru Fukuda 2023-11-21
11791223 Substrate bonding apparatus and substrate bonding method Isao Sugaya, Eiji ARIIZUMI, Yoshiaki Kito, Mikio Ushijima, Masanori ARAMATA +4 more 2023-10-17
11362059 Manufacturing method and manufacturing apparatus for stacked substrate, and program Isao Sugaya, Atsushi Kamashita, Minoru Fukuda 2022-06-14
11211338 Apparatus for stacking substrates and method for the same Isao Sugaya, Kazuya Okamoto, Minoru Fukuda 2021-12-28
11004686 Bonding method, bonding device, and holding member Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda, Ikuhiro Kuwano 2021-05-11
10825707 Stacking apparatus and stacking method Isao Sugaya, Minoru Fukuda 2020-11-03
10483212 Apparatus for stacking substrates and method for the same Isao Sugaya, Kazuya Okamoto, Minoru Fukuda 2019-11-19
10424557 Substrate bonding apparatus and substrate bonding method Isao Sugaya, Minoru Fukuda 2019-09-24