Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264330 | Chip package with connection portion that passes through an encapsulation portion | Yongtae Kwon, Eung Ju Lee, Yong Woon Yeo, Hyo Young Kim, Jun Kyu Lee +1 more | 2022-03-01 |
| 9564411 | Semiconductor package and method of manufacturing the same | Byoung-Yool Jeon | 2017-02-07 |
| 8237276 | Bump structure and fabrication method thereof | Chi-Jung Song, In Soo Kang, Gi Jo Jung, Eung Ju Lee, Jun Kyu Lee +1 more | 2012-08-07 |
| 7977789 | Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same | — | 2011-07-12 |
| 7919833 | Semiconductor package having a crack-propagation preventing unit | — | 2011-04-05 |
| 7906842 | Wafer level system in package and fabrication method thereof | — | 2011-03-15 |