Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198997 | Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients | Su Yun Kim, Dong Hoon OH, Yong Tae Kwon, Jun Kyu Lee, Kyeong Rok SHIN | 2025-01-14 |
| 11404347 | Semiconductor package | Nam Chul Kim, Jong-Heon Kim, Eung Ju Lee, Chang Woo Lee | 2022-08-02 |
| 11264330 | Chip package with connection portion that passes through an encapsulation portion | Yongtae Kwon, Eung Ju Lee, Yun Mook Park, Hyo Young Kim, Jun Kyu Lee +1 more | 2022-03-01 |
| 10804146 | Method for producing semiconductor package | Nam Chul Kim, Yong Tae Kwon, Young Seok Lee | 2020-10-13 |
| 7170170 | Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package | — | 2007-01-30 |