Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8237276 | Bump structure and fabrication method thereof | In Soo Kang, Gi Jo Jung, Yun Mook Park, Eung Ju Lee, Jun Kyu Lee +1 more | 2012-08-07 |
| 7491572 | Method for fabricating an image sensor mounted by mass reflow | Jong-Heon Kim | 2009-02-17 |
| 7122401 | Area array type semiconductor package fabrication method | — | 2006-10-17 |
| 6682957 | Semiconductor substrate and land grid array semiconductor package using same and fabrication methods thereof | — | 2004-01-27 |
| 6484394 | Encapsulation method for ball grid array semiconductor package | Seong-Jae Heo | 2002-11-26 |
| 6441498 | Semiconductor substrate and land grid array semiconductor package using same | — | 2002-08-27 |
| 6316837 | Area array type semiconductor package and fabrication method | — | 2001-11-13 |
| 6031284 | Package body and semiconductor chip package using same | — | 2000-02-29 |
| 5910682 | Semiconductor chip stack package | — | 1999-06-08 |
| 5834837 | Semiconductor package having leads with step-shaped dimples | — | 1998-11-10 |
| 5770888 | Integrated chip package with reduced dimensions and leads exposed from the top and bottom of the package | Ju-Hwa Lee | 1998-06-23 |
| 5554886 | Lead frame and semiconductor package with such lead frame | — | 1996-09-10 |
| 5471088 | Semiconductor package and method for manufacturing the same | — | 1995-11-28 |
| 5444301 | Semiconductor package and method for manufacturing the same | Gi Bon Cha | 1995-08-22 |