Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6399420 | Ultra high density integrated circuit BLP stack and method for fabricating the same | Hee Joong Suh, Chang Kuk Choi | 2002-06-04 |
| RE37413 | Semiconductor package for a semiconductor chip having centrally located bottom bond pads | — | 2001-10-16 |
| 6242798 | Stacked bottom lead package in semiconductor devices | Byeong-Duck Lee | 2001-06-05 |
| 6030858 | Stacked bottom lead package in semiconductor devices and fabricating method thereof | Byeong-Duck Lee | 2000-02-29 |
| RE36097 | Semiconductor package for a semiconductor chip having centrally located bottom bond pads | — | 1999-02-16 |
| 5861668 | Semiconductor package | — | 1999-01-19 |
| 5854740 | Electronic circuit board with semiconductor chip mounted thereon, and manufacturing method therefor | — | 1998-12-29 |
| 5444301 | Semiconductor package and method for manufacturing the same | Chi-Jung Song | 1995-08-22 |
| 5428248 | Resin molded semiconductor package | — | 1995-06-27 |
| 5363279 | Semiconductor package for a semiconductor chip having centrally located bottom bond pads | — | 1994-11-08 |
| 5334873 | Semiconductor packages with centrally located electrode pads | — | 1994-08-02 |