Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672961 | Light-emitting element package having lead frame with connection portion | Byeong Hwang Min, Gam Gon Kim, Bong Kul Min | 2020-06-02 |
| 6516516 | Semiconductor chip package having clip-type outlead and fabrication method of same | — | 2003-02-11 |
| 6242798 | Stacked bottom lead package in semiconductor devices | Gi Bon Cha | 2001-06-05 |
| 6091135 | Lead frame with pre-mold paddle for a semiconductor chip package | — | 2000-07-18 |
| 6030858 | Stacked bottom lead package in semiconductor devices and fabricating method thereof | Gi Bon Cha | 2000-02-29 |
| 5821615 | Semiconductor chip package having clip-type outlead and fabrication method of same | — | 1998-10-13 |