Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6964724 | Etching and cleaning methods and etching and cleaning apparatuses used therefor | Hidemitsu Aoki | 2005-11-15 |
| 6833109 | Method and apparatus for storing a semiconductor wafer after its CMP polishing | Hidemitsu Aoki | 2004-12-21 |
| 6767409 | Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiring | Hidemitsu Aoki | 2004-07-27 |
| 6683007 | Etching and cleaning methods and etching and cleaning apparatus used therefor | Hidemitsu Aoki | 2004-01-27 |
| 6387190 | Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiring | Hidemitsu Aoki | 2002-05-14 |
| 6225217 | Method of manufacturing semiconductor device having multilayer wiring | Tatsuya Usami, Hidemitsu Aoki, Yasuaki Tsuchiya | 2001-05-01 |
| 6140225 | Method of manufacturing semiconductor device having multilayer wiring | Tatsuya Usami, Hidemitsu Aoki, Yasuaki Tsuchiya | 2000-10-31 |
| 6132592 | Method of etching non-doped polysilicon | Hidemitsu Aoki, Yasushi Sasaki | 2000-10-17 |
| 5994142 | Method for collecting a metallic contaminants from a wafer | Hidemitsu Aoki | 1999-11-30 |
| 5925213 | Wet processing apparatus with movable partitioning plate between two processing chambers | — | 1999-07-20 |