Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7250348 | Apparatus and method for packaging semiconductor devices using a patterned photo sensitive film to reduce stress buffering | Pradeep A/L P. Divakaran, Low Chian Inn, Lim Leong Heng | 2007-07-31 |
| 6864167 | Wafer scale solder bump fabrication method and structure | Sri Ganesh A. Tharumalingam, Lim King Tong | 2005-03-08 |