Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9570648 | Wafer level optical proximity sensors and systems including wafer level optical proximity sensors | Seck Jiong Wong | 2017-02-14 |
| 9570649 | Methods for fabricating a plurality of optoelectronic devices from a wafer that includes a plurality of light detector sensor areas | Seck Jiong Wong | 2017-02-14 |
| 7396754 | Method of making wafer level ball grid array | Lee Cheong Chee | 2008-07-08 |
| 7061123 | Wafer level ball grid array | Lee Cheong Chee | 2006-06-13 |
| 6864167 | Wafer scale solder bump fabrication method and structure | Zabarulla Hanifah, Lim King Tong | 2005-03-08 |