Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6864167 | Wafer scale solder bump fabrication method and structure | Sri Ganesh A. Tharumalingam, Zabarulla Hanifah | 2005-03-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6864167 | Wafer scale solder bump fabrication method and structure | Sri Ganesh A. Tharumalingam, Zabarulla Hanifah | 2005-03-08 |