Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5328079 | Method of and arrangement for bond wire connecting together certain integrated circuit components | Arnold R. Smith, Luu Thanh Nguyen | 1994-07-12 |
| 5270262 | O-ring package | Andrew Switky, Chok J. Chia | 1993-12-14 |
| 5208186 | Process for reflow bonding of bumps in IC devices | — | 1993-05-04 |
| 4963233 | Glass conditioning for ceramic package plating | — | 1990-10-16 |
| 4922322 | Bump structure for reflow bonding of IC devices | — | 1990-05-01 |
| 4800178 | Method of electroplating a copper lead frame with copper | Billy J. Lang, II | 1989-01-24 |
| 4714517 | Copper cleaning and passivating for tape automated bonding | Devi P. Malladi, Divyesh P. Shah | 1987-12-22 |
| 4589962 | Solder plating process and semiconductor product | Vijay M. Sajja, Jagdish Belane | 1986-05-20 |