Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6903029 | Method of reducing thick film stress of spin-on dielectric and the resulting sandwich dielectric structure | Ching-Fa Yeh, Yueh-Chuan Lee, Chih-Chuan Hsu, Shuo Wang | 2005-06-07 |
| 6774461 | Method of reducing thick film stress of spin-on dielectric and the resulting sandwich dielectric structure | Ching-Fa Yeh, Yueh-Chuan Lee, Chih-Chuan Hsu, Shuo Wang | 2004-08-10 |
| 6294832 | Semiconductor device having structure of copper interconnect/barrier dielectric liner/low-k dielectric trench and its fabrication method | Ching-Fa Yeh, Yueh-Chuan Lee, Yuh-Ching Su | 2001-09-25 |
| 6251753 | Method of sidewall capping for degradation-free damascene trenches of low dielectric constant dielectric by selective liquid-phase deposition | Ching-Fa Yeh, Yueh-Chuan Lee, Yuh-Ching Su | 2001-06-26 |