Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056410 | Method of manufacturing semiconductor package using alignment mark on wafer | Shiro Hara, Sommawan Khumpuang | 2021-07-06 |
| 10304675 | System for integrating preceding steps and subsequent steps | Michihiro Inoue, Shiro Hara, Arami Saruwatari, Sommawan Khumpuang | 2019-05-28 |
| 10163674 | Circular support substrate for semiconductor | Shiro Hara, Sommawan Khumpuang, Michihiro Inoue, Arami Saruwatari | 2018-12-25 |
| 10163819 | Surface mount package and manufacturing method thereof | Shiro Hara, Sommawan Khumpuang, Michihiro Inoue, Arami Saruwatari | 2018-12-25 |