Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12030140 | Lead-free solder alloy and method of manufacturing electronic device using the same | Young Woo Lee, Seul Gi LEE, Hui Joong KIM, Jae Yool Son, Jae Hun Song | 2024-07-09 |
| 11646285 | Semiconductor package using core material for reverse reflow | Jae Yeol SON, Jae Hun Song, Young Woo Lee, Seul Gi LEE, Min Su Park +1 more | 2023-05-09 |
| 9391039 | Solder balls and semiconductor device employing the same | Jae Yeol SON, Santosh Kumar, Eung Jae KIM, Hui Joong KIM, Ho Gun CHA | 2016-07-12 |
| 9156111 | Lead free solder bumps | Sung Jae Hong, Keun Soo Kim, Chang Woo Lee, Jung Hwan Bang, Yong Ho Ko +7 more | 2015-10-13 |
| 8716860 | Tin-based solder ball and semiconductor package including the same | Young Woo Lee, Im Bok Lee, Sung Jae Hong | 2014-05-06 |
| 8022541 | Au-Ag based alloy wire for semiconductor package | Jong Soo CHO, Yong Jin Park, Eun Kyu Her, Kyu Hwan Oh | 2011-09-20 |
| 6700199 | Gold-silver bonding wire for semiconductor device | Jong Soo CHO, Dong-Ho Joung | 2004-03-02 |
| 6569378 | Apparatus for manufacturing solder balls | Jin Hyung Lee, Byung Chul Moon, Chang-Rok Oh, Jae Gyu Nam | 2003-05-27 |
| 6312498 | Method of manufacturing solder balls | Jin Hyung Lee, Byung Chul Moon, Chang-Rok Oh, Jae Gyu Nam | 2001-11-06 |