Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12030140 | Lead-free solder alloy and method of manufacturing electronic device using the same | Young Woo Lee, Seul Gi LEE, Jae Yool Son, Jae Hun Song, Jeong Tak MOON | 2024-07-09 |
| 11646285 | Semiconductor package using core material for reverse reflow | Jae Yeol SON, Jeong Tak MOON, Jae Hun Song, Young Woo Lee, Seul Gi LEE +1 more | 2023-05-09 |
| 9391039 | Solder balls and semiconductor device employing the same | Jeong Tak MOON, Jae Yeol SON, Santosh Kumar, Eung Jae KIM, Ho Gun CHA | 2016-07-12 |
| 9156111 | Lead free solder bumps | Sung Jae Hong, Keun Soo Kim, Chang Woo Lee, Jung Hwan Bang, Yong Ho Ko +7 more | 2015-10-13 |