Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9165808 | Metal organic chemical vapor deposition device and temperature control method therefor | — | 2015-10-20 |
| 9156111 | Lead free solder bumps | Keun Soo Kim, Chang Woo Lee, Jung Hwan Bang, Yong Ho Ko, Hyuck Lee +7 more | 2015-10-13 |
| 9070726 | Temperature control method of chemical vapor deposition device | — | 2015-06-30 |
| 8716860 | Tin-based solder ball and semiconductor package including the same | Young Woo Lee, Im Bok Lee, Jeong Tak MOON | 2014-05-06 |
| 8481102 | Temperature control method for chemical vapor deposition apparatus | Hong Won Lee, Seok Man Han, Joo Jin | 2013-07-09 |
| 6991854 | Gold alloy bonding wire for semiconductor device | Jong Soo CHO, Yong Jin Park | 2006-01-31 |