Issued Patents All Time
Showing 101–125 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5077242 | Fiber-reinforced ceramic green body and method of producing same | Takashi Nakamoto, Yasunobu Kawakami, Yuki KONO | 1991-12-31 |
| 5051494 | Thermosetting resin composition comprising an aromatic amine | Keizaburo Yamaguchi, Yoshimitsu Tanabe, Tatshuiro Urakami, Akihiro Yamaguchi, Norimasa Yamaya | 1991-09-24 |
| 5049606 | Thermosetting resin composition | Norimasa Yamaya, Akihiro Yamaguchi | 1991-09-17 |
| 5043419 | Process for preparing a polyimide and a composite material containing the same | Saburo Kawashima, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi, Tomohito Koba +5 more | 1991-08-27 |
| 5041520 | Process for preparing polyimide having excellent high temperature stability | Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1991-08-20 |
| 5028641 | Thermosetting resin composition | Norimasa Yamaya, Akihiro Yamaguchi | 1991-07-02 |
| 5013817 | Process for preparing a polyimide and a composite material containing the same | Saburo Kawashima, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi, Tomohito Koba +5 more | 1991-05-07 |
| 4994544 | Production process for polyimide fibers | Taizo Nagahiro, Shuichi Morikawa, Nubohito Koga, Shoji Tamai | 1991-02-19 |
| 4987207 | Thermosetting resin compositions | Norimasa Yamaya, Akihiro Yamaguchi | 1991-01-22 |
| 4987197 | Polyimide/polyamideimide resin composition | Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1991-01-22 |
| 4968762 | Thermosetting-resin-forming composition from bis-maleimide and diallyl bis phenol | Norimasa Yamaya, Akihiro Yamaguchi | 1990-11-06 |
| 4960852 | Thermosetting resin compostion from bis, maleimide and bis (meta-amino phenoxy) compound | Norimasa Yamaya, Nobuhito Koga, Akihiro Yamaguchi | 1990-10-02 |
| 4959440 | Polymide for high-temperature adhesive | Shoji Tamai, Saburo Kawashima, Yoshiho Sonobe, Hideaki Oikawa, Akihiro Yamaguchi | 1990-09-25 |
| 4959443 | Thermosetting resin composition from bis maleimide and aromatic amine resin | Norimasa Yamaya, Akihiro Yamaguchi | 1990-09-25 |
| 4937318 | Aromatic amine resins | Keizaburo Yamaguchi, Yoshimitsu Tanabe, Tatsuhiro Urakami, Akihiro Yamaguchi, Norimasa Yamaya | 1990-06-26 |
| 4937316 | Process for preparing polyimides | Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1990-06-26 |
| 4931531 | Polyimide and high-temperature adhesive thereof | Shoji Tamai, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1990-06-05 |
| 4908409 | Polyimide | Hideaki Oikawa, Katsuaki Liyama, Nobuhito Koga, Saburo Kawashima, Shoji Tamai +1 more | 1990-03-13 |
| 4883718 | Flexible copper-clad circuit substrate | Saburo Kawashima, Yoshiho Snobe, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1989-11-28 |
| 4847349 | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines | Saburo Kawashima, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1989-07-11 |
| 4839232 | Flexible laminate printed-circuit board and methods of making same | Moritsugu Morita, Kazuo Miyazaki, Akihiro Yamaguchi, Shoji Tamai, Kunio Nishihara | 1989-06-13 |
| 4831102 | Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine | Norimasa Yamaya, Nobuhito Koga, Akihiro Yamaguchi | 1989-05-16 |
| 4803258 | Thermoplastic aromatic polyether-pyridine and process for preparing same | Keizaburo Yamaguchi, Hideaki Oikawa, Kenichi Sugimoto, Akihiro Yamaguchi | 1989-02-07 |
| 4797466 | High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine | Hideaki Oikawa, Saburo Kawashima, Shoji Tamai, Yoshiho Sonobe, Akihiro Yamaguchi | 1989-01-10 |
| 4795798 | High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane | Shoji Tamai, Saburo Kawashima, Hideaki Oikawa, Kouji Ohkoshi, Akihiro Yamaguchi | 1989-01-03 |