Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8476740 | Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet | Eiji Hayashishita, Makoto Kataoka, Katsutoshi OZAKI, Mitsuru Sakai | 2013-07-02 |
| 7501312 | Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer | Takanobu Koshimizu, Makoto Kataoka, Masafumi Miyakawa, Hideki Fukumoto | 2009-03-10 |
| 7238421 | Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film | Makoto Kataoka, Masafumi Miyakawa, Shinichi Hayakawa, Kouji Igarashi | 2007-07-03 |
| 7201969 | Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film | Masafumi Miyakawa, Makoto Kataoka, Jun Nakashima, Shinichi Hayakawa, Yasuhisa Fujii | 2007-04-10 |
| 6879026 | Surface protecting adhesive film for semiconductor wafer and processing method for semiconductor wafer using said adhesive film | Hideki Fukumoto, Takanobu Koshimizu, Makoto Kataoka | 2005-04-12 |
| 6730595 | Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used in said method | Yasuhisa Fujii, Makoto Kataoka, Kentaro Hirai, Hideki Fukumoto, Takanobu Koshimizu | 2004-05-04 |