Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7501312 | Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer | Takanobu Koshimizu, Makoto Kataoka, Hideki Fukumoto, Yoshihisa Saimoto | 2009-03-10 |
| 7238421 | Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film | Yoshihisa Saimoto, Makoto Kataoka, Shinichi Hayakawa, Kouji Igarashi | 2007-07-03 |
| 7201969 | Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film | Makoto Kataoka, Jun Nakashima, Yoshihisa Saimoto, Shinichi Hayakawa, Yasuhisa Fujii | 2007-04-10 |