Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8728910 | Expandable film, dicing film, and method of producing semiconductor device | Eiji Hayashishita, Mitsuru Sakai, Setsuko Oike | 2014-05-20 |
| 8476740 | Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet | Eiji Hayashishita, Yoshihisa Saimoto, Makoto Kataoka, Mitsuru Sakai | 2013-07-02 |