Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5443659 | Flux for soldering and solder composition comprising the same and soldering method using the same | Mitsuhiro Nonogaki, Junji Fujino, Akira Adachi, Kohei Murakami, Osamu Hayashi | 1995-08-22 |
| 5175399 | Wiring panel including wiring having a surface-reforming layer and method for producing the same | Mitsumasa Mori, Eishi Gofuku, Mitsuyuki Takada, Kurumi Miyake, Masanobu Kohara | 1992-12-29 |
| 5034569 | Multilayer interconnection circuit board | Eishi Gofuku, Mitsuyuki Tanaka, Hayato Takasago | 1991-07-23 |
| 4914815 | Method for manufacturing hybrid integrated circuits | Mitsuyuki Takada, Hayato Takasago | 1990-04-10 |
| 4783642 | Hybrid integrated circuit substrate and method of manufacturing the same | Mitsuyuki Takada, Hayato Takasago | 1988-11-08 |
| 4752555 | Method of manufacturing multilayer circuit board | Mitsuyuki Takada, Havato Takasago | 1988-06-21 |
| 4685203 | Hybrid integrated circuit substrate and method of manufacturing the same | Mitsuyuki Takada, Hayato Takasago | 1987-08-11 |
| 4643798 | Composite and circuit board having conductive layer on resin layer and method of manufacturing | Mitsuyuki Takada, Hayato Takasago | 1987-02-17 |
| 4629681 | Method of manufacturing multilayer circuit board | Mitsuyuki Takada, Hayato Takasago | 1986-12-16 |
| 4291758 | Preparation of boiling heat transfer surface | Masao Fujii, Yoshifusa Ogawa | 1981-09-29 |