Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6104464 | Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board | Kohei Adachi, Toru Kokogawa, Takanori Takaki, Mitsumasa Mori, Atsushi Tanaka | 2000-08-15 |
| 5604513 | Serial sampling video signal driving apparatus with improved color rendition | Seiki Takahashi, Toshio Tobita, Hiroaki Ishitani, Takatomo Watanabe, Hiroaki Ideno +1 more | 1997-02-18 |
| 5293262 | Liquid crystal display device having heat-insulating members and driving circuit boards attached to rear edges of light box | Kohei Adachi, Hideaki Otsuki, Kenichi Niki, Tetsuro Makita | 1994-03-08 |
| 5269868 | Method for separating bonded substrates, in particular disassembling a liquid crystal display device | Eishi Gofuku | 1993-12-14 |
| 5173844 | Integrated circuit device having a metal substrate | Kohei Adachi, Mitsuyuki Takada, Atsushi Endo, Eishi Gofuku | 1992-12-22 |
| 5113274 | Matrix-type color liquid crystal display device | Seiki Takahashi | 1992-05-12 |
| 5081562 | Circuit board with high heat dissipations characteristic | Kohei Adachi, Mitsuyuki Takada, Eishi Gofuku, Atsushi Endo | 1992-01-14 |
| 5069745 | Process for preparing a combined wiring substrate | Hirofumi Ohuchida, Eishi Gofuku, Akira Ishizu, Toshio Tobita, Mitsuyuki Takada | 1991-12-03 |
| 5034569 | Multilayer interconnection circuit board | Eishi Gofuku, Mitsuyuki Tanaka, Yoshiyuki Morihiro | 1991-07-23 |
| 5029984 | Liquid crystal display device | Kohei Adachi, Hideaki Otsuki, Kenichi Niki, Tetsuro Makita | 1991-07-09 |
| 4993148 | Method of manufacturing a circuit board | Kohei Adachi, Mitsuyuki Takada, Atsushi Endo, Eishi Gofuku | 1991-02-19 |
| 4967261 | Tape carrier for assembling an IC chip on a substrate | Kenichi Niki, Toru Kokogawa | 1990-10-30 |
| 4963389 | Method for producing hybrid integrated circuit substrate | Mitsuyuki Takada, Ryusaku Tsukao | 1990-10-16 |
| 4946709 | Method for fabricating hybrid integrated circuit | Mitsuyuki Takada, Eishi Gofuku | 1990-08-07 |
| 4943768 | Testing device for electrical circuit boards | Kenichi Niki, Tohru Kokogawa, Akira Ishizu | 1990-07-24 |
| 4942140 | Method of packaging semiconductor device | Hideaki Ootsuki, Mitsuyuki Takada, Toru Kokogawa | 1990-07-17 |
| 4914815 | Method for manufacturing hybrid integrated circuits | Mitsuyuki Takada, Yoshiyuki Morihiro | 1990-04-10 |
| 4898805 | Method for fabricating hybrid integrated circuit | Mitsuyuki Takada, Yoichiro Onishi | 1990-02-06 |
| 4887030 | Testing device for electrical circuit boards | Kenichi Niki, Tohru Kokogawa, Akira Ishizu | 1989-12-12 |
| 4854230 | Screen printing apparatus | Kenichi Niki, Tetsuro Makita | 1989-08-08 |
| 4785157 | Method for controlling electric resistance of a compound-type resistors | Eishi Gofuku, Mitsuyuki Takada | 1988-11-15 |
| 4783642 | Hybrid integrated circuit substrate and method of manufacturing the same | Mitsuyuki Takada, Yoshiyuki Morihiro | 1988-11-08 |
| 4685203 | Hybrid integrated circuit substrate and method of manufacturing the same | Mitsuyuki Takada, Yoshiyuki Morihiro | 1987-08-11 |
| 4645734 | Composite having conductive layer on resin layer and method of manufacturing | Mitsuyuki Takada, Atsushi Endo | 1987-02-24 |
| 4643798 | Composite and circuit board having conductive layer on resin layer and method of manufacturing | Mitsuyuki Takada, Yoshiyuki Morihiro | 1987-02-17 |