Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557671 | Semiconductor device having trench gate electrodes formed in first pillars including source layers formed in the first pillars being deeper into the substrate than first source layers in second pillars | Masanao Ito | 2023-01-17 |
| 11189689 | Semiconductor device including an active region that includes a switchable current path | Nobuo Fujiwara, Naoyuki KAWABATA | 2021-11-30 |
| 10854762 | Semiconductor device | Kohei Ebihara, Takanori Tanaka | 2020-12-01 |
| 10529799 | Semiconductor device | Kohei Ebihara | 2020-01-07 |
| 10002931 | Silicon carbide semiconductor device | Naruhisa Miura | 2018-06-19 |
| 9935170 | Silicon carbide semiconductor device and method for manufacturing same | Toshikazu Tanioka, Yoichiro Tarui | 2018-04-03 |
| 9515145 | Vertical MOSFET device with steady on-resistance | Hiroaki OKABE, Tomokatsu Watanabe, Masayuki Imaizumi | 2016-12-06 |
| 9076761 | Silicon carbide semiconductor device and method for manufacturing silicon carbide semiconductor device | Tomokatsu Watanabe, Naruhisa Miura, Shiro Hino, Toshikazu Tanioka | 2015-07-07 |
| 8753951 | Method for manufacturing silicon carbide semiconductor device | Toshikazu Tanioka, Masayuki Imaizumi | 2014-06-17 |
| 8282867 | Insert molding die, insert molding apparatus and insert molding method | Tsuyoshi Arai, Sayaka Okabe | 2012-10-09 |
| 8035178 | Solid-state imaging device | Mitsuyoshi Mori, Yasuhiro Shimada, Takuma Katayama, Kenji Taniguchi | 2011-10-11 |
| 7261854 | Insert molding technique | Tsuyoshi Arai | 2007-08-28 |
| 7166516 | Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN or SiCN | Toshifumi Mori, Young Suk Kim, Takayuki Ohba, Ryou Nakamura | 2007-01-23 |
| 6800538 | Semiconductor device fabrication method and semiconductor fabrication control method | Mitsuaki Hori | 2004-10-05 |