Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12091500 | Tackifier for adhesive composition | Keijirou Okawachi, John Hazen, Wietze BAKKER, Massimiliano Giacomelli Penon | 2024-09-17 |
| 11472976 | Resin for active-energy-ray-curable ink, composition for active-energy-ray-curable ink, and active-energy-ray-curable ink | Keijiro Okawachi | 2022-10-18 |
| 9087816 | Semiconductor device and method of manufacturing the same | Soshi Kuroda, Kenya Hironaga, Masatoshi Yasunaga, Akira Yamazaki | 2015-07-21 |
| 9024454 | Method of manufacturing semiconductor device | Masatoshi Yasunaga, Kenya Hironaga, Soshi Kuroda | 2015-05-05 |
| 8772952 | Semiconductor device with copper wire having different width portions | Masatoshi Yasunaga, Kenya Hironaga, Soshi Kuroda | 2014-07-08 |
| 8692383 | Semiconductor device and method of manufacturing the same | Soshi Kuroda, Kenya Hironaga, Masatoshi Yasunaga, Akira Yamazaki | 2014-04-08 |
| 8629002 | Manufacturing method of semiconductor device | Soshi Kuroda, Masatoshi Yasunaga, Kenya Hironaga | 2014-01-14 |
| 8334172 | Manufacturing method of semiconductor device | Soshi Kuroda, Masatoshi Yasunaga, Kenya Hironaga | 2012-12-18 |
| 7725847 | Wiring design support apparatus for bond wire of semiconductor devices | Akihiro Goto, Hiroshige Ogawa, Yoshio Matsuda | 2010-05-25 |
| 6984882 | Semiconductor device with reduced wiring paths between an array of semiconductor chip parts | — | 2006-01-10 |
| 6515360 | Packaged semiconductor device and manufacturing method thereof | Yoshihiro Tomita | 2003-02-04 |
| 6399422 | Radiating plate structure and method for manufacturing semiconductor devices using the same structure | Yoshihiro Tomita, Hirofumi Makimoto | 2002-06-04 |
| 6384485 | Semiconductor device | — | 2002-05-07 |
| 6232652 | Semiconductor device having a packaged semiconductor element and permanent vent and manufacturing method thereof | — | 2001-05-15 |
| 6191493 | Resin seal semiconductor package and manufacturing method of the same | Masatoshi Yasunaga, Shin Nakao, Shinji Baba, Mitsuyasu Matsuo | 2001-02-20 |
| 6184586 | Semiconductor device including a ball grid array | — | 2001-02-06 |
| 5920770 | Resin seal semiconductor package and manufacturing method of the same | Masatoshi Yasunaga, Shin Nakao, Shinji Baba, Mitsuyasu Matsuo | 1999-07-06 |
| 5753973 | Resin seal semiconductor package | Masatoshi Yasunaga, Shin Nakao, Shinji Baba, Mitsuyasu Matsuo | 1998-05-19 |
| 5656863 | Resin seal semiconductor package | Masatoshi Yasunaga, Shin Nakao, Shinji Baba, Mitsuyasu Matsuo | 1997-08-12 |
| 5067075 | Method of direct memory access control | Minoru Sugano, Akira Horiki, Zenichi Yashiro | 1991-11-19 |