Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10400151 | Agglomerated boron nitride particles, composition containing said particles, and three- dimensional integrated circuit having layer comprising said composition | Masanori Yamazaki, Mari Abe, Tomohide Murase, Yasuhiro Kawase, Makoto Ikemoto +1 more | 2019-09-03 |
| 10125289 | Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor device | Masaya SUGIYAMA, Yasuhiro Kawase, Makoto Ikemoto, Masanori Yamazaki | 2018-11-13 |
| 9847298 | Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate | Yasuhiro Kawase, Makoto Ikemoto | 2017-12-19 |
| 9822294 | Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition | Masanori Yamazaki, Mari Abe, Tomohide Murase, Yasuhiro Kawase, Makoto Ikemoto +1 more | 2017-11-21 |
| 9508648 | Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate | Yasuhiro Kawase, Makoto Ikemoto | 2016-11-29 |