HZ

Haiyan Zhang

Microsoft: 24 patents #1,275 of 40,388Top 4%
3M: 23 patents #543 of 11,543Top 5%
Huawei: 6 patents #2,214 of 15,535Top 15%
ML Magic Leap: 4 patents #322 of 665Top 50%
PF Purdue Research Foundation: 3 patents #492 of 3,174Top 20%
XC Xuzhou Heavy Machinery Co.: 3 patents #9 of 90Top 10%
Basf Se: 2 patents #5,851 of 13,826Top 45%
XC Xi'An Zhongxing New Software Co.: 1 patents #205 of 714Top 30%
ZC Zhongce Rubber Group Co.: 1 patents #4 of 17Top 25%
Samsung: 1 patents #49,284 of 75,807Top 70%
CO Conocophillips: 1 patents #472 of 954Top 50%
CC Crrc Qingdao Sifang Co.: 1 patents #114 of 309Top 40%
TB The Braun: 1 patents #526 of 867Top 65%
TT Tokyo Institute Of Technology: 1 patents #411 of 1,159Top 40%
US University Of Houston System: 1 patents #226 of 554Top 45%
📍 Gormley, CA: #2 of 201 inventorsTop 1%
Overall (All Time): #23,479 of 4,157,543Top 1%
78
Patents All Time

Issued Patents All Time

Showing 76–78 of 78 patents

Patent #TitleCo-InventorsDate
7147767 Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor Steven D. Boyd, Susrut Kesari, William M. Lamanna, Michael J. Parent, Lawrence A. Zazzera 2006-12-12
6746590 Ultrasonically-enhanced electroplating apparatus and methods Harlan L. Krinke 2004-06-08
6641767 Methods for replication, replicated articles, and replication tools Gerald M. Benson 2003-11-04