KK

Kei-Yu Ko

Micron: 22 patents #802 of 6,345Top 15%
Applied Materials: 1 patents #4,780 of 7,310Top 70%
Eastman Kodak: 1 patents #4,972 of 8,114Top 65%
Overall (All Time): #173,204 of 4,157,543Top 5%
24
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10811233 Process chamber having tunable showerhead and tunable liner Andrew Nguyen, Xue Yang Chang, Haitao Wang, Reza Sadjadi 2020-10-20
7470628 Etching methods 2008-12-30
7319075 Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby Li Li, Guy T. Blalock 2008-01-15
7273566 Gas compositions 2007-09-25
7173339 Semiconductor device having a substrate an undoped silicon oxide structure and an overlaying doped silicon oxide structure with a sidewall terminating at the undoped silicon oxide structure Li Li, Guy T. Blalock 2007-02-06
7094700 Plasma etching methods and methods of forming memory devices comprising a chalcogenide comprising layer received operably proximate conductive electrodes Li Li, Terry L. Gilton, John T. Moore, Karen Signorini 2006-08-22
6989108 Etchant gas composition 2006-01-24
6967408 Gate stack structure 2005-11-22
6875371 Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby Li Li, Guy T. Blalock 2005-04-05
6849557 Undoped silicon dioxide as etch stop for selective etch of doped silicon dioxide 2005-02-01
6831019 Plasma etching methods and methods of forming memory devices comprising a chalcogenide comprising layer received operably proximate conductive electrodes Li Li, Terry L. Gilton, John T. Moore, Karen Signorini 2004-12-14
6716766 Process variation resistant self aligned contact etch 2004-04-06
6551940 Undoped silicon dioxide as etch mask for patterning of doped silicon dioxide 2003-04-22
6537922 Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby Li Li, Guy T. Blalock 2003-03-25
6479864 Semiconductor structure having a plurality of gate stacks 2002-11-12
6458685 Method of forming a self-aligned contact opening Dave Pecora 2002-10-01
6444586 Method of etching doped silicon dioxide with selectivity to undoped silicon dioxide with a high density plasma etcher 2002-09-03
6432833 Method of forming a self aligned contact opening 2002-08-13
6337285 Self-aligned contact (SAC) etch with dual-chemistry process 2002-01-08
6277758 Method of etching doped silicon dioxide with selectivity to undoped silicon dioxide with a high density plasma etcher 2001-08-21
6121671 Semiconductor device having a substrate, an undoped silicon oxide structure, and an overlying doped silicon oxide structure with a side wall terminating at the undoped silicon oxide structure Li Li, Guy T. Blalock 2000-09-19
6117788 Semiconductor etching methods 2000-09-12
6117791 Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby Li Li, Guy T. Blalock 2000-09-12
5399900 Isolation region in a group III-V semiconductor device and method of making the same Samuel Chen, Shuit-Tong Lee 1995-03-21