| 12513998 |
Apparatus with voltage protection mechanism |
Milind Nemchand Furia, Michael Chaine, Eric Smith |
2025-12-30 |
|
| 12362244 |
Memory device including circuitry under bond pads |
Chiara Cerafogli, Kenneth W. Marr, Brian J. Soderling, Michael P. Violette, Joshua Daniel Tomayer |
2025-07-15 |
|
| 12354669 |
Discharge circuits |
Kenneth W. Marr, Chiara Cerafogli |
2025-07-08 |
|
| 11908812 |
Multi-die memory device with peak current reduction |
Yui Shimizu |
2024-02-20 |
$18,735,000 |
| 11901727 |
Apparatuses and method for over-voltage event protection |
Michael Chaine |
2024-02-13 |
$12,832,000 |
| 11848323 |
Semiconductor devices with package-level configurability |
John B. Pusey, Zhiping Yin, Kevin G. Duesman |
2023-12-19 |
$18,498,000 |
| 11798935 |
Apparatus with voltage protection mechanism |
Milind Nemchand Furia, Michael Chaine, Eric J. Smith |
2023-10-24 |
$15,333,000 |
| 11508657 |
Semiconductor devices having 3-dimensional inductive structures |
Kevin G. Duesman |
2022-11-22 |
$15,774,000 |
| 11424169 |
Memory device including circuitry under bond pads |
Chiara Cerafogli, Kenneth W. Marr, Brian J. Soderling, Michael P. Violette, Joshua Daniel Tomayer |
2022-08-23 |
$12,962,000 |
| 11398468 |
Apparatus with voltage protection mechanism |
Milind Nemchand Furia, Michael Chaine, Eric J. Smith |
2022-07-26 |
$15,302,000 |
| 11183837 |
Apparatuses and method for over-voltage event protection |
Michael Chaine |
2021-11-23 |
$21,765,000 |
| 11056467 |
Semiconductor devices with through silicon vias and package-level configurability |
Kevin G. Duesman, Warren L. Boyer |
2021-07-06 |
$20,168,000 |
| 10930645 |
Semiconductor devices with package-level configurability |
John B. Pusey, Zhiping Yin, Kevin G. Duesman |
2021-02-23 |
$23,020,000 |
| 10867991 |
Semiconductor devices with package-level configurability |
Kevin G. Duesman, Warren L. Boyer, Jeffrey P. Wright |
2020-12-15 |
$26,973,000 |
| 10811372 |
Semiconductor devices with post-probe configurability |
Kevin G. Duesman, Jeffrey P. Wright, Warren L. Boyer |
2020-10-20 |
$20,299,000 |
| 10784192 |
Semiconductor devices having 3-dimensional inductive structures |
Kevin G. Duesman |
2020-09-22 |
$15,633,000 |
| 10580767 |
Semiconductor devices with package-level configurability |
John B. Pusey, Zhiping Yin, Kevin G. Duesman |
2020-03-03 |
$19,771,000 |
| 10483241 |
Semiconductor devices with through silicon vias and package-level configurability |
Kevin G. Duesman, Warren L. Boyer |
2019-11-19 |
$13,655,000 |
| 10453829 |
Method and apparatus for reducing capacitance of input/output pins of memory device |
Merri L. Carlson, Hongbin Zhu, Gordon A. Haller, Kevin G. Duesman, James Mathew +1 more |
2019-10-22 |
$16,310,000 |
| 10403585 |
Semiconductor devices with post-probe configurability |
Kevin G. Duesman, Jeffrey P. Wright, Warren L. Boyer |
2019-09-03 |
$15,753,000 |
| 10312232 |
Semiconductor devices with package-level configurability |
John B. Pusey, Zhiping Yin, Kevin G. Duesman |
2019-06-04 |
$9,801,000 |
| 10283462 |
Semiconductor devices with post-probe configurability |
Kevin G. Duesman, Jeffrey P. Wright, Warren L. Boyer |
2019-05-07 |
$18,348,000 |
| 10193334 |
Apparatuses and method for over-voltage event protection |
Michael Chaine |
2019-01-29 |
$26,170,000 |
| 10128229 |
Semiconductor devices with package-level configurability |
John B. Pusey, Zhiping Yin, Kevin G. Duesman |
2018-11-13 |
$18,400,000 |
| 9391062 |
Apparatuses, circuits, and methods for protection circuits for dual-direction nodes |
Michael Chaine |
2016-07-12 |
$12,640,000 |
