HC

Houfei Chen

Micron: 13 patents #1,214 of 6,345Top 20%
UW University Of Washington: 1 patents #985 of 2,234Top 45%
IN Intel: 1 patents #18,218 of 30,777Top 60%
📍 Campbell, CA: #332 of 2,187 inventorsTop 20%
🗺 California: #40,325 of 386,348 inventorsTop 15%
Overall (All Time): #310,175 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
12416964 Methods and apparatus for bi-directional control of computing unit frequency Jianwei Dai, Jianfang Zhu, Ivan Chen, Deepak Samuel Kirubakaran, Rajshree Chabukswar +1 more 2025-09-16
9622358 Method for forming a circuit board via structure for high speed signaling Shiyou Zhao, Hao Wang 2017-04-11
9055702 Method for forming a circuit board via structure for high speed signaling Shiyou Zhao, Hao Wang 2015-06-09
8743555 Methods for suppressing power plane noise Shiyou Zhao 2014-06-03
8516695 Method for forming a circuit board via structure for high speed signaling Shiyou Zhao, Hao Wang 2013-08-27
8508950 Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise Shiyou Zhao 2013-08-13
8243479 On-die anti-resonance structure for integrated circuit 2012-08-14
8023293 On-die anti-resonance structure for integrated circuit 2011-09-20
7992297 Method for forming a circuit board via structure for high speed signaling Shiyou Zhao, Hao Wang 2011-08-09
7778039 Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise Shiyou Zhao 2010-08-17
7676919 Method for forming a circuit board via structure for high speed signaling Shiyou Zhao, Hao Wang 2010-03-16
7660708 S-matrix technique for circuit simulation 2010-02-09
7633773 On-die anti-resonance structure for integrated circuit 2009-12-15
7459638 Absorbing boundary for a multi-layer circuit board structure Shiyou Zhao, Hao Wang 2008-12-02
7149666 Methods for modeling interactions between massively coupled multiple vias in multilayered electronic packaging structures Leung W. Tsang, Chungchi Huang, Vikram Jandhyala 2006-12-12