Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9622358 | Method for forming a circuit board via structure for high speed signaling | Houfei Chen, Hao Wang | 2017-04-11 |
| 9055702 | Method for forming a circuit board via structure for high speed signaling | Houfei Chen, Hao Wang | 2015-06-09 |
| 8743555 | Methods for suppressing power plane noise | Houfei Chen | 2014-06-03 |
| 8516695 | Method for forming a circuit board via structure for high speed signaling | Houfei Chen, Hao Wang | 2013-08-27 |
| 8508950 | Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise | Houfei Chen | 2013-08-13 |
| 7992297 | Method for forming a circuit board via structure for high speed signaling | Houfei Chen, Hao Wang | 2011-08-09 |
| 7778039 | Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise | Houfei Chen | 2010-08-17 |
| 7676919 | Method for forming a circuit board via structure for high speed signaling | Houfei Chen, Hao Wang | 2010-03-16 |
| 7459638 | Absorbing boundary for a multi-layer circuit board structure | Houfei Chen, Hao Wang | 2008-12-02 |