Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8138617 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo +4 more | 2012-03-20 |
| 7358154 | Method for fabricating packaged die | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo +4 more | 2008-04-15 |
| 6894386 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo +4 more | 2005-05-17 |