Issued Patents All Time
Showing 26–50 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9244101 | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures | Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard | 2016-01-26 |
| 8808800 | Methods of forming three-dimensional structures having reduced stress and/or curvature | Ananda H. Kumar, Jorge Sotelo Albarran, Adam L. Cohen, Kieun Kim, Michael S. Lockard +1 more | 2014-08-19 |
| 8729916 | Methods of creating probe structures from a plurality of planar layers | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2014-05-20 |
| 8723543 | Methods of creating probe structures from a plurality of planar layers | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2014-05-13 |
| 8713788 | Method for fabricating miniature structures or devices such as RF and microwave components | Elliot Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard +1 more | 2014-05-06 |
| 8717055 | Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2014-05-06 |
| 8717054 | Methods of creating probe structures from a plurality of planar layers | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2014-05-06 |
| 8702955 | Electrochemical fabrication method including elastic joining of structures | Adam L. Cohen, Vacit Arat, Michael S. Lockard | 2014-04-22 |
| 8613846 | Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen +2 more | 2013-12-24 |
| 8601405 | Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids | — | 2013-12-03 |
| 8551314 | Mesoscale and microscale device fabrication methods using split structures and alignment elements | Adam L. Cohen, Michael S. Lockard | 2013-10-08 |
| 8512861 | Multi-layer three-dimensional structures having features smaller than a minimum feature size associated with the formation of individual layers | Michael S. Lockard, Adam L. Cohen, Vacit Arat | 2013-08-20 |
| 8262916 | Enhanced methods for at least partial in situ release of sacrificial material from cavities or channels and/or sealing of etching holes during fabrication of multi-layer microscale or millimeter-scale complex three-dimensional structures | Michael S. Lockard, Adam L. Cohen | 2012-09-11 |
| 8241228 | Micro-scale and meso-scale hydraulic and pneumatic tools, methods for using, and methods for making | Adam L. Cohen, Chris Folk, Richard T. Chen | 2012-08-14 |
| 8070931 | Electrochemical fabrication method including elastic joining of structures | Adam L. Cohen, Vacit Arat, Michael S. Lockard | 2011-12-06 |
| 7828952 | Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids | — | 2010-11-09 |
| 7830228 | Miniature RF and microwave components and methods for fabricating such components | Elliot Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard +1 more | 2010-11-09 |
| 7679388 | Cantilever microprobes for contacting electronic components and methods for making such probes | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2010-03-16 |
| 7611616 | Mesoscale and microscale device fabrication methods using split structures and alignment elements | Adam L. Cohen, Michael S. Lockard | 2009-11-03 |
| 7557595 | Cantilever microprobes for contacting electronic components and methods for making such probes | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2009-07-07 |
| 7531077 | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures | Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard | 2009-05-12 |
| 7527721 | Electrochemical fabrication method for producing multi-layer three-dimensional structures on a porous dielectric | Pavel B. Lembrikov, Adam L. Cohen | 2009-05-05 |
| 7524427 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang +2 more | 2009-04-28 |
| 7517462 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang +2 more | 2009-04-14 |
| 7511523 | Cantilever microprobes for contacting electronic components and methods for making such probes | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2009-03-31 |