Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7979813 | Chip-scale package conversion technique for dies | Richard Dolan, Haowei Wu | 2011-07-12 | $3,573,000 |
| 7273761 | Box-in-box field-to-field alignment structure | Martin E. Garnett | 2007-09-25 | $7,445,000 |
| 7211893 | Integrating chip scale packaging metallization into integrated circuit die structures | Martin Alter | 2007-05-01 | $8,077,000 |
| 6984531 | Electrical field alignment vernier | — | 2006-01-10 | $7,976,000 |
| 6900538 | Integrating chip scale packaging metallization into integrated circuit die structures | Martin Alter | 2005-05-31 | $10,847,000 |
| 6815128 | Box-in-box field-to-field alignment structure | Martin E. Garnett | 2004-11-09 | $2,824,000 |
| 6762432 | Electrical field alignment vernier | — | 2004-07-13 | $3,293,000 |
| 6762434 | Electrical print resolution test die | Hiu Ip, Arthur Lam | 2004-07-13 | $3,293,000 |
| 6649932 | Electrical print resolution test die | Hui F Ip, Arthur Lam | 2003-11-18 | $11,476,000 |