Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7915744 | Bond pad structures and semiconductor devices using the same | Chao-Chun Tu | 2011-03-29 |
| 7646087 | Multiple-dies semiconductor device with redistributed layer pads | Chao-Chun Tu | 2010-01-12 |
| 6207535 | Method of forming shallow trench isolation | Kan-Yuan Lee, Joe Ko, Gary Hong | 2001-03-27 |
| 6046601 | Method for measuring the kink effect of a semiconductor device | Meng-Lin Yeh | 2000-04-04 |